From megawatt-scale power delivery to advanced cooling systems and accelerated computing, Compal showcases the core infrastructure for next-generation AI factories.
/PRNewswire/ — CompalElectronics, Inc. (Compal; TWSE: 2324), a global leader in IT and infrastructure solutions, today announced that it will demonstrate its next-generation AI factory infrastructure at l’OCP Global Summit 2026to demonstrate how power, cooling, computing power, and array-scale engineering must evolve together to meet the rapidly growing demands of NVIDIA’s accelerated computing.
Compal Electronics showcases its next-generation AI factory infrastructure featuring advanced power and cooling technologies at the OCP Global Summit 2026 in San Jose.
As AI data centers reach unprecedented levels of compute density and require megawatts of power, the challenge is no longer simply about adding more GPUs. Accelerated computing infrastructure, from power to thermal management to rack integration, must be redesigned to meet the performance, efficiency and scalability demands of next-generation AI workloads.
During the OCP summit, Compal will show how it designs this infrastructure around accelerated computing solution by NVIDIAcombining high-density computing platforms with next-generation power and cooling technologies to create a more integrated foundation for scalable AI factories.
Rethinking power supply for the AI Factory
Power architecture is becoming one of the main challenges for large-scale AI infrastructures. To respond to the rapid increase in rack power density, Compal is developing a power architecture with 800VDC and megawatt power infrastructure designed to meet the demands of next-generation AI data centers.
By moving toward high-voltage DC architectures and more efficient power supply, Compal aims to reduce the complexity of power conversion and support increasingly dense AI environments. This approach makes it possible to establish a scalable energy infrastructure, capable of adapting to future generations of accelerated computing.
Cooling infrastructure designed for higher density
Higher computing density also requires a major overhaul of thermal management. Compal expands its infrastructure portfolio thanks to advanced liquid cooling technologies and its megawatt-scale cooling capabilitiesallowing AI systems to operate efficiently as array density continues to increase.
Rather than viewing compute, power, and cooling as separate systems, Compal views them as interconnected elements of the AI factory. By taking into account all of these technologies at the scale of racks and data centers, Compal is able to optimize the infrastructure according to the requirements of high-performance accelerated computing.
Engineering, from network to GPU
Together, these capabilities demonstrate Compal’s evolution beyond individual server platforms to a more holistic AI infrastructure strategy. By combining accelerated computing, power, cooling and rack-scale integration with global engineering and manufacturing resources, Compal helps customers bridge the gap between cutting-edge AI technologies and their large-scale deployment in the real world.
“Building the next generation of AI-driven factories requires us to rethink the entire infrastructure related to accelerated computing,” said Alan Chang, Vice President of ISBG at Compal. “Compal combines power, cooling, rack integration and NVIDIA accelerated computing to help customers build AI infrastructure that can efficiently scale from platform level to megawatt deployments.”
At OCP, Compal will demonstrate how these infrastructure technologies come together to address growing power, thermal management and deployment challenges in the AI era, by designing critical infrastructure, from the power grid to the GPU.
Come visit Compal at OCP Global Summit 2026, booth #E65, to learn about the infrastructure behind the next generation of AI factories powered by NVIDIA technologies.
About Compal
Founded in 1984, Compal is today one of the world’s leading manufacturers of computers and connected devices, working with leading brands around the world. Compal has been recognized by CommonWealth Magazine as one of the top seven Taiwanese manufacturers and is consistently ranked among the Forbes Global 2000 companies. Compal has actively expanded into new growth areas, including cloud servers, automotive electronics, smart medical and health care, and advanced communications solutions. Headquartered in Taipei, Taiwan, Compal operates design and production facilities in the United States, Taiwan, China, Vietnam, Mexico, Brazil and Poland. To learn more, visit https://www.compal.com
