AMD’s Lisa Su Opens CES With Gaming To Data Center Advances
After a couple of years of virtual and hybrid events due to the COVID-19 pandemic, CES this week returned to Las Vegas with a fully open venue welcoming about 100,000 attendees.
Kicking off CES 2023 was AMD CEO Lisa Su who, along with such special guests as HP Inc. President and CEO Enrique Lores and Lenovo Executive Vice President and President of International Markets Matt Zielinski, showed the power of AMD’s new lineup of processors, GPUs and AI accelerators.
Su said that 2023 is an incredible time to be in the semiconductor industry given the difficulties businesses and users have faced. However, she said, the industry also had to deal with what she called an incredible surge in demand that stressed all aspects of the semiconductor supply chain.
[Related: The 10 Coolest Gadgets Revealed At CES 2023]
“One thing is true: The pandemic made it clear that semiconductors are absolutely essential to everything that we do,” she said. “Virtually every product, every service, every experience in our lives is powered by semiconductors. Whether you’re talking about cloud services, or how we work, game and connect, chips have become a critical enabler of everything in our modern life. And with the growth of AI across all of these applications, the technology is becoming even smarter and more sophisticated every single day.”
AMD, Su said, is all about pushing the envelope in high-performance and adaptive computing, and using technology to create solutions to the world’s most important challenges. And to emphasize that point, she used her CES 2023 keynote address to highlight five key areas where AMD is investing, along with some of the new technologies the semiconductor manufacturer is introducing over the next few months to meet the new requirements she identified, including:
• New AMD Ryzen 7040 series mobile processors featuring what the company calls the fastest PC processor graphics
• Ryzen AI technology to bring dedicated AI hardware to x86 processors
• AMD Ryzen 7045HX mobile processors with up to 16 Zen 4 cores
• AMD Ryzen 7000X3D processors with AMD 3-D V-Cache technology
• AMD Radeon RX 7000 laptop GPU with AMD RDNA 3 architecture
• AMD Alveo V71 AI accelerator
• AMD Instinct MI300 data center processor with integrated CPU, GPU, and HBM3 memory
Here is a closer look at these new technologies.
LEARN MORE: Servers | Notebooks | Desktop-Clients | AI | CPUs-GPUs
Joseph F. Kovar is a senior editor and reporter for the storage and the non-tech-focused channel beats for CRN. He keeps readers abreast of the latest issues related to such areas as data life-cycle, business continuity and disaster recovery, and data centers, along with related services and software, while highlighting some of the key trends that impact the IT channel overall. He can be reached at [email protected].
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