/PRNewswire/ — As infrared technology, particularly uncooled thermal imaging, continues to evolve, its uses are expanding from the traditional areas of security and industrial inspection to include applications in the automotive industry, consumer outdoor products and smart devices. According to the report„Thermal Imaging and Sensing 2026″ (Thermal imaging technology and sensors 2026) from the global market research and strategy consulting company Yole Group, around 90% of global deliveries in 2025 were accounted for by the five leading manufacturers of infrared thermal imaging cameras. Among them, Raytron ranked first with a market share of 30%, maintaining its global market leadership for the second year in a row.
Behind this success is Raytron’s continued investment in technological innovations, ranging from the development of infrared detectors to advanced assembly and interconnection technology to AI algorithms.
Advances in miniaturization and resolution of infrared detectors
By gradually reducing the pixel pitch from 35µm to 17µm and 12µm to 8µm, Raytron has continuously advanced the miniaturization of infrared detectors and improved their resolution. Raytron developed its infrared detector with a pixel pitch of 8µm in 2021 and began series production in 2025. Smaller pixel pitches allow more pixels to be integrated on the same detector area, improving spatial resolution. Smaller pixel pitches can also enable smaller detectors and lower system costs for the same resolution, thereby promoting wider use of thermal imaging technology.
Greater efficiency and greater integration in assembly and connection technology
Building on WLP, Raytron introduced SWLP (Super Wafer Level Packaging), which features an innovative double-layer structure designed to improve detector protection and reduce reliance on dedicated cleanroom environments for downstream integration.
At CIOE 2026, Raytron presented BCoS (Bump Chip on Substrate) technology for assembly and connection technology. Compared to traditional WLP solutions, BCoS eliminates the need for wire bonding and simplifies component construction. For products with comparable specifications, BCoS reduces detector thickness by approximately 21% and footprint by nearly 40%, enabling more compact designs and greater manufacturing efficiency.
Creating added value through AI-powered infrared imaging
Artificial intelligence is becoming a key driver for the wider use of thermal imaging technology. At CIOE 2026, Raytron presented its infrared image language model. The model was trained on a proprietary multimodal infrared dataset with over 5 million data samples, can now be run directly on devices and is already used for intelligent analysis in areas such as industrial temperature measurement, gas detection and security monitoring with night vision technology.
Driven by the mission of “Create Incremental Value for Customers Through Technological Advancement,” Raytron continually improves imaging performance and expands the applications of thermal imaging to provide greater value to customers and promote its wider use in various industries.
Further information can be found here:
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Website: https://en.raytrontek.com
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