- The annual flagship technology conference is in its seventh year and recognizes technology partnerships
- A record 321 exhibits demonstrate vertical integration and precision manufacturing
- A 20 meter long wall presents components up to the system integration of the next generation AI infrastructure
- The most comprehensive bundled intelligence gathered on the HHTD26
/PRNewswire/ — HonHai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday reaffirmed its industry-leading position in “token factory” solutions by providing unprecedented insight into components and system technologies that enable next-generation AI infrastructure and by highlighting its long-standing partnerships for the first time.
At the 7th annual Hon Hai TechDay 2026 (HHTD26), Foxconn showcased the world-leading strengths in vertical integration and precision manufacturing that underpin its work on the NVIDIA Vera Rubin platform – from full rack-level integration of AI supercomputing systems to submicron component manufacturing technologies.
In two firsts, Foxconn introduced the NVIDIA DSX POD, a standardized, factory-manufactured reference design that enables partners to pre-install NVIDIA Vera Rubin rack-scale AI infrastructure into modular containers, perform critical validations before shipping, and connect the units to the prepared on-site infrastructure after delivery. This took center stage at the event, captivating attendees, while a customer area with photos of key moments and timelines of technology milestones paid tribute to the behind-the-scenes partnerships that have captured the imagination of the technology industry.
“Foxconn is transforming itself into a technology manufacturing platform service provider,” said Foxconn Chairman Young Liu. “From test to finished product, our vertical integration and precision manufacturing make the impossible possible. We are building this strength across diverse ecosystems, from smart consumer electronics to AI and electric vehicles to space and robotics.”
Of the record-breaking 321 exhibits at HHTD26, a quarter were in the “Token Factory” area. “Extreme Co-Design” is a visual tour along a 20-meter-long wall displaying circuit boards containing tens of thousands of micron-scale precision-engineered components; a wireless, tubeless, and fanless compute module design for AI servers in a single generation; the next AI megatrend “Co-Packaged Optics” (CPO); as well as redesigned power, cooling and high-speed data transmission solutions for a more efficient AI infrastructure.
An immersive, simulated AI computing hall demonstrated how AI computing, networking, power and cooling are co-designed for an AI factory, including NVIDIA’s 800 VDC power distribution. Visionbay.ai, Foxconn’s dedicated business unit for AI supercomputing and cloud operations and an NVIDIA cloud partner, plans to design its facility using NVIDIA DSX MaxLPS principles to maximize the AI factory’s performance per watt within a specified performance framework and optimize computing power, power and cooling configurations before construction begins.
On stage, NVIDIA, Google LLC and Schneider Electric discussed AI infrastructure; Honda R&D Co., Ltd. and Mitsubishi Electric Mobility discussed next-generation electric mobility. HHTD26’s most embodied intelligence gathered in the “Robotics and Humanoids” zone, demonstrating the potential of a growing ecosystem and practical examples of industrial products used in robotics.
As a further first, Foxconn drew on its extensive know-how in the area of high-precision manufacturing processes, supported by its own systems for machining, material processing and mold making. The Precision Manufacturing zone showcased technologies that created the Poketomo AI companion robots and single-punch cases for laptops.
The importance of AI security was a common theme throughout the exhibits, as Foxconn teams demonstrated how the NVIDIA Open Agent Safety Platform can support agent safety in Smart Healthcare, Smart Manufacturing and Robotics, and Smart City.
HHTD26 will take place from October 30th to 31st at Taipei Nangang Exhibition Center, Hall 1, 1st and 4th floors. As part of the two-day annual conference, a family-friendly pavilion was set up for the first time, where children can experience and explore topics such as sustainability, mobility, smart factories and smart cities up close.
You can find out more about Hon Hai Tech Day 2026 here.
Information about Foxconn can be found here.