- The flagship annual technology conference, held for the 70e consecutive year, celebrates technological partnerships
- Among the 321 pieces on display, a record number, at HHTD26, a quarter made up the Token Factory zone
- 20-meter-long wall showcases components needed for system integration of next-generation AI infrastructure
- The greatest display of embodied intelligence ever assembled at HHTD26
/PRNewswire/ — Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday confirmed its industry leadership in token factory solutions with an unprecedented overview of components and system technologies enabling next-generation AI infrastructure and highlighting its historic partnerships for the first time.
At the 7th annual Hon Hai Tech Day 2026 (HHTD26), Foxconn unveiled the global vertical integration and precision manufacturing strengths underlying its work on the NVIDIA Vera Rubin Platform, from full rack-level AI supercomputing system integration to submicron-scale component manufacturing technologies.
Foxconn introduced two first-of-its-kind new features: the NVIDIA DSX POD, a standardized, factory-built reference design that allows partners to pre-integrate NVIDIA Vera Rubin rack-scale AI infrastructure into modular containers, perform critical validation before shipping, and connect units to prepared site infrastructure after delivery. This feature dominated the venue and welcomed visitors, while a customer zone with photos of key moments and important technology timelines paid tribute to the behind-the-scenes partnerships that have captured the imagination of the technology industry.
“Foxconn is transforming itself into a technology manufacturing platform service provider,” said Young Liu, Chairman of Foxconn. “From testing to practical implementation, our vertical integration and precision manufacturing make the impossible possible. We are building this type of strength across ecosystems from smart consumer electronics to AI and electric vehicles, as well as in space and robotics. »
Among the 321 products on display, a record number, at HHTD26, a quarter was dedicated to the Token Factory zone. The extreme co-design is a visual tour of a 20-meter-long wall featuring circuit boards mounted with tens of thousands of micrometer-precision components; a cable-free, pipe-less, fan-less compute tray design for AI servers, completed in a single generation; the next AI megatrend, co-packaged optics (CPO); and redesigned power, cooling and high-speed data solutions for a more efficient AI infrastructure.
A simulated, immersive AI data room demonstrated how AI compute, networking, power, and cooling are co-designed for an AI factory, including NVIDIA 800 VDC power distribution. Visionbay.ai, Foxconn’s dedicated AI supercomputing and cloud operations business unit and NVIDIA Cloud partner, plans to design its facility using NVIDIA DSX MaxLPS principles to maximize its AI factory performance per watt within a fixed energy envelope and optimize compute, power and cooling configurations prior to construction.
On stage, NVIDIA, Google LLC and Schneider Electric discussed AI infrastructure; Honda R&D Co Ltd and Mitsubishi Electric Mobility discussed next-generation electromobility. The most embodied intelligence for HHTD26 gathered in the Robotics and Humanoid area, showing the potential of a growing ecosystem and illustrating examples of concrete applications of industrial products used in robotics.
In another first, Foxconn leveraged its rich heritage of ultra-precision manufacturing processes, supported by its proprietary machining, material processing and mold-making equipment, with a precision manufacturing zone peppered with technologies that helped create Poketomo AI companion robots and unique punch-hole cases for laptops.
Among the exhibits, the importance of AI safety was a common thread, with Foxconn teams demonstrating how the NVIDIA Open Agent Safety platform could support agent safety in the areas of smart health, smart manufacturing and robotics, and smart city.
HHTD26 takes place from October 30 to 31 at Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day annual conference launched for the first time a family pavilion for children to interactively experience exploratory youth themes, such as sustainable development, mobility, smart factory and smart city.
To learn more about Hon Hai Tech Day 2026, click here.
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